Tungsten copper (W-Cu) and molybdenum copper (Mo-Cu) are composed of respectively tungsten and molybdenum with copper, which called two-phase composites and has many advantages when it used in some devices with high power, such as high hardness, high strength, high melting point, excellent chemical stability, excellent thermal and electrical conductivity and lower coefficient of thermal expansion. As a kind of electronic packaging heat sink material takes place of conventional materials gradually, the related researchers make an intensive study on tungsten copper, which includes add active agents, change powder properties to improve the sintering density of tungsten copper materials.
However, the conditions of some industries today have become more and more strict (including temperature, pressure, power, etc.), which requires tungsten copper has better properties. Inspired by tungsten carbide with gradient structure, the Japanese researcher propose new concept of dingal materials with gradient structure and from the preparation process structure, computer simulation and forecasting has done sufficient research, have also made substantial progress, so that it plays an important role in some high-power devices. Tungsten copper composite material is kind of two-phase psudoalloy, which composed of two metals tungsten and copper with a great difference in physicochemical properties.
Its properties will chang with the structure. Viewed from the aspect of gradient structure, it can has one end with a high hardness, high melting point, tungsten or copper content is low high-density tungsten copper, while the other end is a good electrical and thermal conductivity and high plasticity of copper or copper content of tungsten, copper, in this way the formation of gradient structure having a tungsten-copper composite materials have a good specificity and a broader application prospect.
